No Solder Fillet at Madaline Hill blog

No Solder Fillet. A protrusion formed after solder paste printing, resembling a sharp tip that bridges. Web a solder fillet exhibiting nonuniform/ uneven flow lines/swirls with hard demarcation lines (no fillet at swirl interfaces), and a dull finish are typically. This procedure includes figures and tables for solder joint acceptability criteria on a variety of component types. Defective solder fillet at a cmc after wave soldering caused by excessive adhesive being pushed onto the landing. Web the solder thickness (5) between the lead and the pad landing is not specified, but a properly wetted fillet must be present.

IPC JSTD001 Standard for Soldering Sierra Circuits
from www.protoexpress.com

A protrusion formed after solder paste printing, resembling a sharp tip that bridges. Web the solder thickness (5) between the lead and the pad landing is not specified, but a properly wetted fillet must be present. Defective solder fillet at a cmc after wave soldering caused by excessive adhesive being pushed onto the landing. This procedure includes figures and tables for solder joint acceptability criteria on a variety of component types. Web a solder fillet exhibiting nonuniform/ uneven flow lines/swirls with hard demarcation lines (no fillet at swirl interfaces), and a dull finish are typically.

IPC JSTD001 Standard for Soldering Sierra Circuits

No Solder Fillet A protrusion formed after solder paste printing, resembling a sharp tip that bridges. Web a solder fillet exhibiting nonuniform/ uneven flow lines/swirls with hard demarcation lines (no fillet at swirl interfaces), and a dull finish are typically. Defective solder fillet at a cmc after wave soldering caused by excessive adhesive being pushed onto the landing. Web the solder thickness (5) between the lead and the pad landing is not specified, but a properly wetted fillet must be present. A protrusion formed after solder paste printing, resembling a sharp tip that bridges. This procedure includes figures and tables for solder joint acceptability criteria on a variety of component types.

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